The Evolution of Payment Specifications and Tokenization – Part 1
Webinar Date: Thursday, October 1, 2015, 1pm ET/10am PT
The Smart Card Alliance and EMVCo hosted the first installment of a two-part webinar series, “The Evolution of Payment Specifications and Tokenization.” The first webinar discusses progress made by the U.S. market in adopting EMV chip payments, contactless mobile payments and payment tokenization, based on global specifications and describes how EMVCo’s scope has evolved from the original EMV Chip Specification to now include card and terminal type approval, interoperability, contactless, mobile, next generation and more recently, the specifications for payment tokenization and 3D Secure 2.0.
Webinar speakers included Randy Vanderhoof, Smart Card Alliance; Brian Byrne, EMVCo
The second webinar will be held on Wednesday, November 4, at 1pm ET/10am PT and will focus on tokenization. Register for the second webinar at: https://attendee.gotowebinar.com/register/7479164334065672193